doc. no : qw0905-ly 2040/tbs-x rev. : a date : 31 - mar. - 2005 data sheet ly2040/tbs-x tape and box type led lamps ligitek electronics co.,ltd. property of ligitek only
p 25.0min note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.0min 2.54typ ?? 0.5 typ 3.0 4.0 5.2 4.2 1.5max t ly2040 ly2040/tbs-x page 1/5 part no. h1 h2 p2 d p1 f l w0 w3 w1 w2 package dimensions g h ligitek electronics co.,ltd. property of ligitek only
585 ligitek electronics co.,ltd. property of ligitek only peak wave length f pnm absolute maximum ratings at ta=25 j typical electrical & optical characteristics (ta=25 j ) note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. tstg storage temperature ly2040/tbs-x yellow emitted gaasp/gap yellow diffused lens part no material color soldering temperature tsol peak forward current duty 1/10@10khz reverse current @5v power dissipation operating temperature t opr ir pd i fp forward current parameter i f symbol part no. ly2040/tbs-x j -40 ~ +100 viewing angle 2 c 1/2 (deg) 2.6 1.7 35 min. max. 36 20 8.0 min. typ. forward voltage @20ma(v) spectral halfwidth ??f nm luminous intensity @10ma(mcd) max 260 j for 5 sec max (2mm from body) -40 ~ +85 10 j g a 60 80 mw ma ratings y 20 ma unit page 2/5
20.0 tbs-9 19.0 0.75 0.79 l description maxmum minimum symbol 265 mm 330 overall thickness overall width h quantity/box w overall length l 2.4 1.97 60 50 2500pcs 10.4 275 10.8 inch mm inch 13.0 13.4 340 w h 9.75 0.33 8.5 w0 ------- feed hole location dimensions symbol information ?e remark:tbs=tape and box straight leads adhesive tape position adhesive t ape width tape width specification package dimensions ?e w2 ------- ------- w3 ------- w1 4.0 0 0 0.69 17.5 19.0 0.57 14.5 15.5 feed hole to overall com ponent height feed hole pitch lead location center of component location overall taped pack age thickness lead length after com ponent height 13.0 0.49 12.4 p ------- p2 ------- ------- t ------- p1 7.7 0.2 5.1 ------- ------- 1.42 0.17 4.4 5.8 h2 ------- ------- l tbs-10 36 ------- ------- w0 11.0 0.72 18.4 19.4 0.38 0.16 0.75 0.61 0.51 0.3 0.06 0.23 1.42 0.43 0.76 part no. ly2040/tbs-x page 3/5 maximum 3.0 0.09 2.3 f ------- component lead pitch feed hole to bottom of com ponent front-to-rear deflection 27.5 28.5 1.08 tbs-4 tbs-6 tbs-8 tbs-7 tbs-5 h1 20.9 0.78 19.9 0.96 0.94 24.5 24.0 25.5 25.0 0.89 22.5 23.5 tbs-1 tbs-3 tbs-2 ------- ? h 18.5 0.69 17.5 1.0 0.85 25.5 21.5 26.5 22.5 ------- ------- 2.0 dimensions symbol information ?e symbol items tape feed hole diameter minimum option code symbol ------- d mm inch mm 0.15 3.8 4.2 specifications 0.12 1.12 0.82 1.0 0.98 0.93 0.73 1.04 0.89 0.08 inch 0.17 ligitek electronics co.,ltd. property of ligitek only
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip part no. ly2040/tbs-x page4/5 fig.6 directivity radiation 0 x 30 x -30 x 60 x 100% 75% 25% 050% -60 x 75% 50% 100% 25%
mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec this test intended to see soldering well performed or not. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles thermal shock test solder resistance test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. high temperature high humidity test 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 reference standard 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test item test condition reliability test: description page 5/5 ligitek electronics co.,ltd. property of ligitek only part no. ly2040/tbs-x
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